J3-Series (SiC J3-T-PM) - Mitsubishi Electric Semiconductor Website

Advantages

Extra-compact, scalable, high reliability transfer-molded 2-in-1 package
High reliability Direct Lead Bonding (DLB) wire bond less package for automotive inverters
Low power loss Trench SiC MOSFET Integrated Multi-Function-Chip for temperature-sensing and rapid SC protection
Pb-free structure, compliant with RoHS directive (2011/65/EU)”